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PT100MF1MP1
● Soldering Instructions
1. When using solder reflow methods, follow the time and temperature profile shown below. Sharp recommends
sending parts through this process only once.
MAX
240°C
200°C
1 ~ 4°C/s
MAX
165°C
1 ~ 4°C/s
1 ~ 4°C/s
25°C
120 s MAX.
10 s MAX.
60 s MAX.
90 s MAX.
2. If using an infrared lamp to preheat the parts, such heat sources may cause localized high temperatures in the
part’s resin. Be sure to keep the heat profile within the guidelines shown in figure above.
3. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
4. Sharp recommends checking the soldering process to ensure these guidelines are followed.
Sheet No.: D1-A01601EN
8
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